FLOPACK is a yet another unique product from Flomerics designed to generate
accurate thermal libraries of IC components, standard test harnesses, and other
associated parts. More...
Why choose FLOPACK?
Use FLOPACK to:
Predict junction and case temperatures of IC components accurately in your designs
Generate thermal models 100X faster than conventional approaches
Generate state-of-the-art detailed and compact models of IC components
Share and archive thermal libraries within your organization using our unique workgroup features
Communicate thermal information to your external vendors or customers in a standardized manner
Did you know that:
70% of FLOPACK users are system integrators trying to get a head start in predicting component performance in their system or board designs?
FLOPACK is the only commercial software tool that can actually generate high-accuracy DELPHI compact models?
FLOPACK's scheduled release cycles are as frequent as 16 weeks, and response to urgent customer requests for features could be a few weeks or less?
Flomerics
Releases PCB Design Survey Highlighting Conflict Between Thermal and SI/EMC
Design Requirements. More...
Flomerics is pleased to announce the release of FLOPACK Version 6.2, with the following new features
New package families: FLOPACK continues to support new package families with every release. This release further enhances our offering of
discrete/power package portfolio.
Sanity checks on package design sheets: The last release featured sanity checks for the package smartpart wizards. In this release, a much more extensive set of sanity checks has been implemented directly at the design sheet level. Minimize your data entry errors with this new feature!
Underfill option for two-resistor model calculation: Two-resistor model submissions now come with an option for adding underfill to the Theta-JB (Ring Cold Plate) test.
